http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107703189-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b475bf1a56f163bfe6ad5491ad2eb5d2 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N27-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01N27-00 |
| filingDate | 2017-10-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ec970d80ef9d121975c1642680e12058 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f75c47f52a745527b163092bf6218ef8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4d5254bd06ec52de48e4774a1b14340b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a137436aaeff1f2a75c83d9f523a71d3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6fbf546db6a838773675fc8b92f8a564 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_df61c0c76c7f2fa49a590408a3b4f817 |
| publicationDate | 2018-02-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-107703189-A |
| titleOfInvention | The ceramic package of MEMS gas sensors and module |
| abstract | The invention provides the ceramic package of a kind of MEMS gas sensors and module, wherein, MEMS gas sensors include air-sensitive chip, base of ceramic and stainless steel cover plate, and the air-sensitive chip is arranged on inside the base of ceramic, and the stainless steel cover plate lid is located on base of ceramic；The base of ceramic includes Base body and pedestal pads；Air-vent is offered on the stainless steel cover plate；The air-sensitive chip includes silicon substrate micro-hotplate, heating electrode, measuring electrode and air-sensitive material, one end of the silicon substrate micro-hotplate upper surface is two heating electrodes, the other end of the silicon substrate micro-hotplate upper surface is two measuring electrodes, the middle part of the silicon substrate micro-hotplate upper surface is air-sensitive material, and isolation channel is provided between the heating electrode and the measuring electrode；The measuring electrode is connected to the pedestal pads by being bonded gold thread；MEMS modules ceramic package also includes being arranged on the asic chip inside the base of ceramic. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112034005-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109613086-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111735546-A |
| priorityDate | 2017-10-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 23.