| abstract |
The invention discloses a high-adhesion thermoplastic polyimide resin, a polyimide film containing the resin and a flexible copper clad laminate. The high-adhesion thermoplastic polyimide resin is prepared from the following raw materials in parts by weight: 0.1-7.5 parts of inorganic particles, which consist of 0.1-2.5 parts of hydroxyapatite and the balance of nano silicon dioxide; 21-79 parts of diamine, which consists of 21-63 parts of aromatic diamine and the balance of aliphatic diamine; 26-118 parts of dianhydride; 325-450 parts of aprotic polar solvent. The TPI film prepared by the polyimide resin, the polyimide film and the copper foil are pressed to form the flexible copper clad laminate, even if the thickness of the TPI layer is 2.0 mu m, the peeling strength of the TPI film and the copper foil can be ensured to be more than or equal to 1.0N/mm, and the bending resistance of the TPI and the PI is more than 50 times; and the surface electrostatic adsorption, CTE and water absorption of the obtained TPI film can be reduced, and the mechanical property, heat resistance, flame retardance and insulating property of the obtained TPI film are improved to a certain extent. |