http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107680957-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_7ec5bdcabfdf64ed0d5b9cc12772ff64 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-58 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-645 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-58 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-64 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-14 |
| filingDate | 2017-10-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b4628b30a6c6bd4cd20595a871ba40c1 |
| publicationDate | 2018-02-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-107680957-A |
| titleOfInvention | A kind of anti-interference semiconductor structure |
| abstract | The invention discloses a kind of anti-interference semiconductor structure, semiconductor structure includes semiconductor interference component and interference layer assembly, semiconductor interference component includes semiconductor chip, auxiliary mutual inductor, semiconductor circuit board and semiconductor chip installing plate, the upper surface of semiconductor circuit board is fixedly installed semiconductor chip installing plate, and the upper surface middle position of semiconductor chip installing plate is fixedly installed semiconductor chip；Semiconductor chip holder is internally formed the environment of sealing, screen layer is provided with the inwall of semiconductor chip holder, because screen layer is made up of first screen layer, secondary shielding layer, the 3rd screen layer and the 4th screen layer, pass through multilayer proofing, reduce semiconductor chip and semiconductor chip is disturbed to external component interference and external component, the bottom surface of installing plate is provided with pin, then semiconductor chip holder is placed on external circuit board by pin, offered convenience to user. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112614928-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-112614928-A |
| priorityDate | 2017-10-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 65.