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filingDate 2017-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2020-03-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2020-03-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-107674643-B
titleOfInvention High-temperature-resistant packaging adhesive for flip Chip On Board (COB) and preparation method thereof
abstract The invention provides a high-temperature-resistant packaging adhesive for an inverted COB (chip on Board), which comprises a component A and a component B with equal mass; the component A comprises the following raw materials in parts by mass: 90-110 parts of vinyl silicone oil, 0.1-0.5 part of platinum catalyst, 1-5 parts of tackifier and 0.1-2 parts of heat-resistant agent; the component B comprises the following raw materials in parts by mass: 50-80 parts of vinyl MQ silicon resin, 30-60 parts of a cross-linking agent and 0.01-0.05 part of an inhibitor. The packaging adhesive provided by the invention belongs to the technical field of LED packaging adhesives, has excellent high-temperature resistance, can not crack even at a high temperature of 280 ℃ for a long time, and simultaneously keeps good light transmittance.
priorityDate 2017-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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