| abstract |
A SnAgCuSb-based Pb-free solder alloy is disclosed. The disclosed solder alloys are particularly suitable for, but not limited to, creating solder joints in the form of solder preforms, solder balls, solder powders, or solder pastes (mixtures of solder powders and fluxes) for harsh environment electronic devices. Additives selected from 0.1 wt% to 2.5 wt% Bi and/or 0.1 wt% to 4.5 wt% In may be included In the solder alloy. |