| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-302
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2461-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2264-107
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2363-00 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L101-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-092
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F28F21-089
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F28F21-065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-249
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K5-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B3-40 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B3-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K5-14 |
| filingDate |
2016-05-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2020-09-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2020-09-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-107614620-B |
| titleOfInvention |
Resin composition, resin sheet, prepreg, insulator, cured resin sheet, and heat dissipation member |
| abstract |
The resin composition contains a thermosetting resin, a thermally conductive filler and mica, and the thermally conductive filler is divided into a filler group (A) with a particle size of 10 μm or more and 100 μm or less, and a filler group with a particle size of 1.0 μm or more and less than 10 μm (B) and the filler group (C) having a particle size of 0.1 μm or more and less than 1.0 μm, the volume-based ratio of the above-mentioned filler group (C) in the above-mentioned thermally conductive filler is larger than that of the above-mentioned filler group (B) in The volume-based ratio occupied in the above-mentioned thermally conductive filler. |
| priorityDate |
2015-05-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |