http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107574330-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C30-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C28-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C26-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C22C1-10 |
| filingDate | 2017-08-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2019-06-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2019-06-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-107574330-B |
| titleOfInvention | Diamond particles enhance molten alloy thermal interfacial material and preparation method thereof |
| abstract | The invention discloses a kind of diamond particles enhancing molten alloy thermal interfacial materials and preparation method thereof, diamond enhancing molten alloy highly heat-conductive material of the invention is by the raw material of following mass parts: 40 ~ 100 parts of molten alloy, 30 ~ 80 parts of diamond particles, 10 ~ 20 parts of tungsten, 10 ~ 20 parts of diluent compositions；Successively diamond particles are surface-treated, in its coating surface tungsten layer, adds in liquid metals and obtains diamond particles enhancing molten alloy thermal interfacial material.The interface bond strength of diamond particles enhancing molten alloy thermal interfacial material is on the one hand improved using technical solution of the present invention, on the other hand be conducive to diamond particles to be preferably dispersed in liquid metals, improve its heating conduction, it is easy to operate, thermal conductivity is high, thermal stability is high, can be used for the fields such as electric appliance, electronic package material heat dissipation. |
| priorityDate | 2017-08-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 45.