http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107527842-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T156-10 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-324 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-67103 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6831 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6833 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6835 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-67 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-683 |
| filingDate | 2014-05-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2020-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2020-11-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-107527842-B |
| titleOfInvention | Substrate support assembly and thermally conductive base |
| abstract | The present invention relates to substrate support assemblies and thermally conductive substrates. The substrate support assembly includes a ceramic puck and a thermally conductive base having an upper surface that engages a lower surface of the ceramic puck. The thermally conductive substrate includes a plurality of thermal zones and a plurality of thermal isolators extending from an upper surface of the thermally conductive substrate toward a lower surface of the thermally conductive substrate, wherein each of the plurality of thermal Approximate thermal isolation between two of the plurality of thermal zones at the upper surface. |
| priorityDate | 2013-05-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 27.