http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107527822-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4828 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-14 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-48 |
| filingDate | 2017-08-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2019-10-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2019-10-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-107527822-B |
| titleOfInvention | A kind of graphic method of nitride ceramics copper-clad plate and graphical nitride ceramics copper-clad plate |
| abstract | A kind of graphic method of nitride ceramics copper-clad plate and graphical nitride ceramics copper-clad plate.Graphical resist layer is set on the surface of nitride ceramics copper-clad plate, nitride ceramics copper-clad plate is formed using active soldering legal system；First time etching process is carried out to nitride ceramics copper-clad plate using the first etching solution, the first etching solution includes CuCl 2 Solution or FeCl 3 Solution；Second of etching process is carried out to the nitride ceramics copper-clad plate Jing Guo first time etching process using the second etching solution；And third time etching process is carried out to the nitride ceramics copper-clad plate by second of etching process using third etching solution.Etching efficiency of the present invention is high, etches uniform no residue, improves etching quality, and plymetal surface state is good. |
| priorityDate | 2016-08-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 43.