http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107415369-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_04e25119aae9aec1e546900c3e31f617 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2260-021 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2262-101 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-302 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2037-1215 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B37-1207 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B7-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B38-162 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B17-061 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B5-02 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B7-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B17-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B17-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B37-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B38-16 |
| filingDate | 2017-06-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_31385b9a4825a4712dd9c8f2f6ea20e3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9639583dcee7aeeba4fa971f79f7fa1b |
| publicationDate | 2017-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-107415369-A |
| titleOfInvention | Manufacturing method of high-voltage-resistant high-thermal conductivity copper-clad aluminum substrate for LED TV backlight |
| abstract | The invention discloses a method for manufacturing a high-voltage-resistant high-heat-conduction copper-clad aluminum substrate for an LED TV backlight source, belonging to the field of circuit boards. With the technology of high pressure resistance and high thermal conductivity, the thickness of the aluminum oxide film on the surface of the aluminum plate and the thickness of the copper oxide film on the surface of the copper foil are both 5‑10um, and the high Thermally conductive adhesive, coated with high thermally conductive adhesive on the top of the aluminum plate, coated with high thermally conductive adhesive on both sides of the glass cloth, baked at 165°C for 30 minutes to make a cured sheet, coated with high thermally conductive adhesive on the bottom of the copper foil, coated with high thermally conductive adhesive on the aluminum plate, and put the cured sheet on top of the cured sheet The bottom surface of the copper foil coated with high thermal conductivity adhesive constitutes an aluminum plate, A film, cured film, B film, and copper foil, which are placed in sequence. After 160°C for 30 minutes, press at 175°C for 180 minutes to form a high-voltage resistant LED TV backlight. High thermal conductivity copper-clad aluminum substrate. For circuit board production. The design is scientific and reasonable, the structure is simple and ingenious, the effect is stable and reliable, the production is easy and the cost is low, and it is convenient for popularization and application. |
| priorityDate | 2017-06-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 46.