| abstract |
By providing an adhesive sheet with a low water vapor transmission rate and high elasticity before heat curing, it is possible to provide an electronic device with improved reliability such as better insulation breakdown test results and even a hollow structure. The device can also be easily manufactured in a way that its shape. A resin sheet for electronic parts, comprising (a) an acrylic copolymer, (b) a thermosetting resin, (c) an inorganic filler, and (d) a silane coupling agent having an amino group, and (a) an acrylic copolymer The product contains 30 mol% or more of acrylonitrile units in the constituent monomer units, and the content of the (a) acrylic copolymer in the resin sheet for electronic components is 2 to 5% by weight. |