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filingDate 2016-02-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2020-08-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2020-08-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-107406678-B
titleOfInvention Thermally conductive silicone composition
abstract The present invention provides a heat conductive silicone composition which does not cause peeling of heat dissipating grease even when placed under severe reliability test conditions and can maintain low thermal resistance, the composition comprising: (A) an organopolysiloxane having at least 2 alkenyl groups in 1 molecule and having a kinematic viscosity at 25 ℃ of 10 to 100000mm 2 100 parts by mass of (A), (B) a hydrolyzable methylpolysiloxane having a 3-functional group at one end and 50 to 130 parts by mass of (C) an aluminum powder having an average particle diameter of 7 to 16 μm, (D) a zinc oxide powder having an average particle diameter of 2 μm or less, (E) an organohydrogenpolysiloxane, (F) an organohydrogenpolysiloxane other than the component (E) containing at least 2 silicon atom-bonded hydrogen atoms in 1 molecule, and (G) a platinum group hydrosilylation catalyst in an effective amount, wherein when a liquid obtained by mixing and dispersing the composition and 2 times the amount of toluene is screened, the content of a residue screened with a 250 mesh (63 μm pore diameter) is 5ppm or less, and the content of a residue screened with a 440 mesh (32 μm pore diameter) is 200ppm or more.
priorityDate 2015-03-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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