| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-28035 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-7684
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1409
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-044
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-00 |
| filingDate |
2016-02-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2021-05-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2021-05-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-107396639-B |
| titleOfInvention |
Abrasive composition |
| abstract |
The present invention provides a polishing composition capable of polishing elemental silicon at a higher polishing rate. The polishing composition of the present invention is used for polishing an object to be polished comprising elemental silicon and a silicon-containing compound other than elemental silicon, the polishing composition comprising abrasive grains and a dispersion medium, and the abrasive grains have a unit surface area of The number of silanol groups exceeds 0 pieces/nm 2 and is 2.0 pieces/nm 2 or less. |
| priorityDate |
2015-02-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |