| abstract |
The present invention discloses a kind of semiconductor packages and its manufacturing method.The semiconductor packages of embodiment according to the present invention includes: wiring portion comprising multiple layers, the multiple layer include insulating layer and wiring layer；Semiconductor chip is encapsulated in the wiring portion, and is electrically connected by bond pad with the wiring layer；Cover covers the side of the semiconductor chip and the wiring portion, and contacts with wiring layer described at least one；And encapsulating material, seal the cover.Therefore, cover covers semiconductor chip, and contacts with the wiring portion being formed in below semiconductor chip, so as to reduce Electromagnetic Interference phenomenon, can make the operation room noise minimization of semiconductor packages, and improve signal speed. |