http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107353855-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2201-08 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J179-085 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J133-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-06 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J179-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06 |
| filingDate | 2017-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2019-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2019-03-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-107353855-B |
| titleOfInvention | A kind of chip adhesive agent and preparation method thereof that low resin is precipitated |
| abstract | The invention discloses a kind of chip adhesive agent and preparation method thereof that low resin is precipitated, and are related to organic bond field.Inhibitor 0.5-5% is precipitated including modified bismaleimide resin 5-30%, acrylate 10-50%, curing agent 0.5-5%, stabilizer 0.01-0.5%, toughener 2-20%, filler 10-40%, coupling agent 0.5-2%, resin.The bimaleimide resin of low viscosity and high heat resistance is introduced in acrylate system, and then improves the heat resistance and anti-aging property of acrylate adhesive；" bridging action " of the organic titanic compound between resin, substrate, filler is utilized simultaneously, effectively inhibits the precipitation of resin, to produce a kind of chip adhesive agent of high heat resistance, high intensity that a variety of substrates are precipitated without resin. |
| priorityDate | 2017-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 83.