http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107347231-B

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filingDate 2016-06-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2019-11-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2019-11-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-107347231-B
titleOfInvention The production method of circuit base plate
abstract The production method that the present invention discloses a kind of circuit base plate, includes the following steps.The core layer for having core dielectric layer, the first patterned line layer and the second patterned line layer is provided.Formationization nickel coating is in the first patterned line layer and the second patterned line layer.Changing nickel coating has first thickness, and first thickness is between 1 micron to 10 microns.Thinning program is carried out to nickel coating is changed, second thickness is thinned to by first thickness so as to change nickel coating, and forms slimming nickel coating.Second thickness is between 0.01 micron to 0.9 micron.Formationization plates palladium layers on slimming nickel coating.Surface metal protective layer is formed in change plating palladium layers.
priorityDate 2016-05-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 32.