http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107316744-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B2235-3251 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B2235-6025 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B2235-3224 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B2235-3284 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B2235-94 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B2235-95 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B2235-3262 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B2235-656 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B2235-3418 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B2235-3409 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B2235-3208 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G4-1227 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G4-2325 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B35-468 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G4-008 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G4-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B41-5116 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C3-066 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B41-88 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G4-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C04B35-468 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G4-232 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G4-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C03C3-066 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C04B41-88 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G4-008 |
| filingDate | 2017-07-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2019-04-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2019-04-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-107316744-B |
| titleOfInvention | A kind of chip multilayer gold electrode chip capacitor and preparation method thereof |
| abstract | The present invention provides a kind of chip multilayer gold electrode chip capacitors and preparation method thereof, are related to a kind of capacitor technology field.This chip multilayer gold electrode chip capacitor, is prepared using the preparation method of chip multilayer gold electrode chip capacitor: being carried out that ceramic dielectric porcelain powder is prepared with plurality of raw materials, then green diaphragm is made in ceramic dielectric porcelain powder；Production is using gold as the interior electrode of material on green diaphragm；Termination electrode is prepared using thin film sputtering process.This chip multilayer gold electrode chip capacitor equivalent series resistance is significantly low; avoid the high-temperature oxydation problem of silver migration and Ni/Cu electrode of the Pd/Ag electrode under the working environment of high temperature and humidity; the stability of significant increase product; solve the problems, such as that the phase counterdiffusion between termination electrode and interior electrode reduces performance indicator; further improve the reliability of product; and it is suitble to the microwave assembly technology requirement of spun gold or gold ribbon welding, installation space can be reduced, it is easy to accomplish large-scale production. |
| priorityDate | 2017-07-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 49.