| abstract |
The present invention relates to a resin composition and its use. Specifically, the present invention relates to a resin composition comprising: 20-35 parts by weight of a multifunctional epoxy resin; 8-15 parts by weight of isocyanate modified epoxy resin; 5-10 parts by weight of bifunctional epoxy resin; 40-65 parts by weight of polyphenylene ether resin; and 8-16 parts by weight of cyanate ester resin. The invention also relates to products of the resin composition, which comprise resin films, bonding sheets, prepregs, composites, laminates and printed circuit boards. Through the combination of different resins, this application has realized the stack of product performance for the product still has heat-resisting, low dielectric loss and workable composite effect when having good outward appearance. |