http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107263671-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B2235-3225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B2235-44 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B2235-448 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B2235-444 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B2235-349 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B2235-658 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B2235-6567 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B35-638 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B35-622 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B28B11-243 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B35-806 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C04B35-581 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B28B1-29 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B28B1-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C04B35-581 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B28B11-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C04B35-622 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C04B35-638 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C04B35-80 |
| filingDate | 2017-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2019-06-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2019-06-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-107263671-B |
| titleOfInvention | A kind of preparation method of the composite modified aluminium nitride chip of resistance to shrinkage type of twin crystal palpus |
| abstract | The invention discloses a kind of preparation methods of the composite modified aluminium nitride chip of resistance to shrinkage type of twin crystal palpus, belong to electronic package material preparation technical field.The present invention will take kaolin, sodium sulphate mix grinding is sieved and is sintered, it is impregnated after washed drying with hydrofluoric acid solution again, filtering, drying is washed after obtaining filter cake, obtain modified crystal whiskers, again by magnesium chloride, Boratex and Klorvess Liquid mixed calcining, it is filtered after obtaining sintering feed with deionized water immersion, filter residue is mixed with modified crystal whiskers, and modified blank is mixed and made into polyvinyl butyral etc., by its ball milling sieving after with aluminium nitride powder, yttrium oxide is through mix grinding, tape casting after deaeration, matrix must be cast, by it after dumping is handled sinter molding, the composite modified aluminium nitride chip of resistance to shrinkage type of twin crystal palpus can be obtained, gained aluminium nitride chip of the invention has density big, resistance to contraction, the small feature of angularity, substrate has excellent heat conductivity simultaneously, it is a kind of ideal electronic package material. |
| priorityDate | 2017-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 53.