http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107236976-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-12 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 |
| filingDate | 2017-07-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2018-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2018-11-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-107236976-B |
| titleOfInvention | Leveling agent, the metal plating compositions containing it and preparation method, application |
| abstract | The present invention discloses a kind of leveling agent, the metal plating compositions containing it and preparation method, application.The raw material of metal plating compositions disclosed by the invention includes metal electroplating solution and leveling agent, and metal electroplating solution includes metal salt, acidic electrolyte bath, halogen ion source and water, and metal salt is mantoquita, and leveling agent is the compound such as Formulas I structure.The metal plating compositions are for the plating on electroplating printed circuit board and IC wafer or chip, it is capable of providing good thermal reliability and covering power, and it is able to solve aperture sealing problem, the product after gained plating is low with defect, coating impurity without cavity, the good, compact structure of plating property, surface roughness is small. |
| priorityDate | 2017-07-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 119.