| abstract |
A semiconductor device has a lead frame including pads (101) surrounded by elongated leads (110) separated from the pads by gaps (113) and extending to the frame, the pads and The lead has a first thickness and has a first surface and a second surface opposite and parallel to the first surface; the lead has a first portion (112) of the first thickness close to the gap and a second portion (111) of the first thickness close to the frame ), and a region of reduced second thickness between the first portion and the second portion; the second surface of the first lead portion is coplanar with the second surface (111a) of the second portion. A semiconductor chip with terminals is attached to the pads. The metal wire connection from the terminal to the adjacent lead includes a stitch bond attached to the first surface of the lead. |