| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2933-0066
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68381
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68322
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-95
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-0095
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81001
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2933-0033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13111
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13109
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-131 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-167
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0753
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-156
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-97
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-0095
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-0093
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6835 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-15 |
| filingDate |
2015-12-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2021-01-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2021-01-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-107210351-B |
| titleOfInvention |
Method for manufacturing light emitting diode array on back plate |
| abstract |
The present invention provides a backplane optionally having stepped horizontal surfaces and optionally embedded metal interconnect structures. The first conductive bonding structure is formed on the first stepped horizontal surface. First light emitting devices on a first transfer substrate are disposed on the first conductive bonding structures, and a first subset of the first light emitting devices are bonded to the first conductive bonding structures. Laser radiation can be employed to selectively disconnect the first subset of the first light emitting devices from the first transfer substrate while a second subset of the first light emitting devices remain attached to the first transfer substrate. Additional devices on each additional transfer substrate may be bonded to additional conductive bonding structures on the backplane in the same way, provided that the additional devices are not present in locations that would overlap with pre-existing first light emitting devices or devices on the backplane at the bonding locations. |
| priorityDate |
2014-12-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |