http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107207935-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J2463-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-0806 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-001 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J9-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J163-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J163-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-04 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J9-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22 |
| filingDate | 2016-01-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2021-02-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2021-02-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-107207935-B |
| titleOfInvention | Thermally and electrically conductive adhesive composition |
| abstract | A thermally conductive and electrically conductive adhesive composition comprising (a) an electrically conductive filler, (B) an epoxy resin, (C) a curing agent, and (D) an organic solvent, wherein the (a) electrically conductive filler is submicron silver fine powder, and the mass ratio of the blending amount of the (a) electrically conductive filler to the blending amount of the (B) epoxy resin is (a)/(B) 96.0/4.0 to 99.5/0.5, (B) the epoxy resin contains at least a bisphenol-type epoxy resin and a novolak-type epoxy resin, (C) the curing agent is diaminodiphenyl sulfone and/or a derivative thereof, and the blending amount of the (C) curing agent is 0.4 to 2.4mol equivalent in terms of active hydrogen equivalent with respect to 1mol equivalent of an epoxy group of the (B) epoxy resin. Provided is a thermally conductive and electrically conductive adhesive composition which is useful as a die bonding material, has high heat dissipation and stable electrical conductivity, and exhibits high adhesion. |
| priorityDate | 2015-02-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 102.