abstract |
The object of the present invention is to provide the resin combinations that can be realized not only with heat resistance, anti-flammability and moisture absorption heat resistance also excellent printed circuit board.The resin combination is the resin composition for printed circuit board containing cyanate esters (A) and epoxy resin (B), and the cyanate esters (A) are to carry out naphthols dihydroxy naphthlene aralkyl resin or dihydroxy naphthlene aralkyl resin obtained from cyanic acid esterification. |