http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107189447-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-035 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-025 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2203-206 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2201-08 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J183-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-08 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-07 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J183-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J183-07 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J183-05 |
| filingDate | 2017-07-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2020-05-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2020-05-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-107189447-B |
| titleOfInvention | Damp-heat-resistant LED packaging silica gel and preparation method and application thereof |
| abstract | The invention relates to a moisture-heat resistant LED packaging silica gel, and a preparation method and application thereof, and belongs to the technical field of material chemistry. The moisture-heat resistant LED packaging silica gel consists of a component A and a component B, wherein the component A comprises: methyl phenyl vinyl silicone resin, platinum catalyst and addition type tackifier; the part B comprises: methyl phenyl vinyl silicone resin, methyl phenyl hydrogen-containing silicone resin and a reaction inhibitor. The moisture-heat resistant LED packaging silica gel is obtained by selecting specific raw materials to be matched with each other, so that the moisture and heat resistant performance of an SMD device is improved, the problems of moisture absorption in the storage process of the SMD device and easy glue cracking and degumming in the lead-free reflow soldering process are solved, the risk is reduced, and the production efficiency is improved. |
| priorityDate | 2017-07-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 48.