http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107113984-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R12-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-36 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49838 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49894 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4857 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R11-01 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-486 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-11 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-323 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49866 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R12-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49811 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49822 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49827 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R11-01 |
| filingDate | 2015-12-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2019-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2019-06-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-107113984-B |
| titleOfInvention | Multilayer wiring board |
| abstract | The present invention provides a multilayer wiring board capable of realizing excellent conduction reliability. In the multilayer wiring board of the present invention, an anisotropic conductive member including an insulating base material containing an inorganic material and a wiring board having a substrate and one or more electrodes formed on the substrate are laminated. ; a plurality of conductive paths including a conductive member, provided in a state of penetrating in the thickness direction of the insulating base material and being insulated from each other; and an adhesive layer provided on the surface of the insulating base material, each conductive path having The protrusions protruding from the surface of the insulating base material, in the multilayer wiring board, among the plurality of conductive paths, the conductive paths that are in contact with the electrodes are deformed, and the adjacent conductive paths are brought into contact with each other. |
| priorityDate | 2014-12-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 35.