http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107108821-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L61-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L61-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-3415 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-013 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F290-14 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F290-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-3415 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-14 |
| filingDate | 2015-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2019-07-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2019-07-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-107108821-B |
| titleOfInvention | Thermosetting resin composition |
| abstract | The present invention provides a thermosetting resin composition which is excellent in processability and can obtain a highly reliable cured product (molded body) excellent in heat resistance and mechanical strength by curing. The thermosetting resin composition of the present invention contains (A) a polyalkenyl phenol resin, (B) an aromatic polymaleimide compound, and (C) a polymerization initiator, and the (A) polyalkenyl phenol resin has in its molecule (a1) at least one aromatic ring unit having a phenolic hydroxyl group to which a 2-alkenyl group is bonded and (a2) at least one aromatic ring unit having a phenolic hydroxyl group to which a 2-alkenyl group is not bonded, and each aromatic ring unit passes through the main chain A linking group not composed of an aromatic ring is bonded, and when the number of aromatic ring units in (a1) is represented by m and the number of aromatic ring units in (a2) is represented by n, the ratio of m to (m+n) is 40 ~90%, the thermosetting resin composition contains (A) more than 0.4 to 1.5 moles of the 2-alkenyl group relative to 1 mole of the maleimide group of the (B) aromatic polymaleimide compound. Alkenyl phenol resin. |
| priorityDate | 2014-12-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 93.