http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107104120-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3e5fc74d4c7bfbde0c20deefb4536cca http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3c020a3bfe9d62d22c33f10c20d4262b |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-82 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10N59-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10B61-00 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-82 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-22 |
| filingDate | 2017-05-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_38877bb6672c4f3ff8a785661c7ac5c9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_541f92da6c97378b36d5825da7d429b3 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5eb225b956fe5c4dfdc58c1a946f4cc1 |
| publicationDate | 2017-08-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-107104120-A |
| titleOfInvention | Magnetic induction device and manufacturing method |
| abstract | The magnetic induction device provided by the present invention includes: a substrate, a first metal layer and a first dielectric layer, a groove is opened on the first surface of the substrate, the first metal layer is arranged in the groove, and the The surface of the first metal layer is lower than the first surface, the surface of the first metal layer and the first surface form a first recess, and the first dielectric layer is disposed on the first surface of the substrate And the first dielectric layer fills the first recess. In the magnetic induction device and manufacturing method provided by the embodiments of the present invention, the surface of the first metal layer is lower than the surface of the substrate to form the first depression, and the first dielectric layer is arranged on the surface of the substrate and fills the first depression, so that the first metal The thickness of the dielectric between the layer and the surface metal layer is increased while the thickness of the dielectric in other areas remains unchanged, which can not only reduce the parasitic capacitance and increase the breakdown voltage, but also reduce the risk of substrate warping and dielectric layer peeling. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113506669-A |
| priorityDate | 2017-05-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 24.