| abstract |
Method for detecting thinning of a semiconductor substrate of an integrated circuit from its backside, comprising measuring end points representing two conductive contacts (C1, C2) at the interface between an insulating region (RIS) and an underlying substrate region (CS) The physical quantity of electrical resistance between parts (EX11, EX21), said two conductive contacts (C1, C2) at least partly extend into said insulating region (RIS). |