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filingDate 2017-05-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2018-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2018-09-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-107099825-B
titleOfInvention The electroplate liquid formulation and lead tin plating technique of electronic component lead tin plating technique
abstract The present invention provides a kind of electroplate liquid formulation and lead tin plating technique of electronic component lead tin plating technique, and electroplate liquid formulation includes the following each component of mass-volume concentration:Sulfuric acid (AR) 70~120g/L, 45~60g/L of stannous sulfate, 0.2~0.8g/L of sodium hypophosphite, 0.5~1.5g/L of ascorbic acid, 2~6g/L of polyethylene glycol, 1~1.5g/L of catechol, 10 8~10g/L of emulsifier of 1~1.5g/L of Beta Naphthol 99MIN, cerous sulfate 3~6g/L, OP, 10~30g/L of phenolsulfonic acid, other are pure water.Lead tin plating technique, light Passivation Treatment is drawn using hot melt after tin plating, the consistency of the tin plating tin layers for the product produced using the formula and production technology is greatly improved, to improve anti-tin palpus growth performance, high temperature resistant and Anti- tarnishing ability, the resistance to neutral salt spray performance of product.
priorityDate 2017-05-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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