| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02E10-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C2217-445
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C2218-119 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D5-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C3-122
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C8-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C8-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C3-07
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C17-008
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C03C3-142
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L31-022425 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D5-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L31-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L31-0224
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C03C3-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C03C8-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C03C8-10 |
| filingDate |
2015-10-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2020-04-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2020-04-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-107077908-B |
| titleOfInvention |
Thick film pastes containing lead-tungsten based oxides and their use in the manufacture of semiconductor devices |
| abstract |
The present invention provides a thick film paste for printing the front side of a solar cell device having one or more insulating layers and a method for doing so. The thick film paste contains a conductive metal source and a lead-tungsten based oxide dispersed in an organic medium. The present invention also provides a semiconductor device including electrodes formed from the thick film paste. |
| priorityDate |
2014-10-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |