http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107075713-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-627 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-611 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C19-002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C19-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-58 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C22C9-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-008 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D17-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-562 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D21-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D17-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-58 |
| filingDate | 2015-06-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2019-09-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2019-09-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-107075713-B |
| titleOfInvention | Copper-Nickel Alloy Electroplating Equipment |
| abstract | The invention provides a copper-nickel alloy electroplating device, which can stably form an electroplating layer with a uniform composition of copper and nickel on an object to be plated, and can use the electroplating bath for a long time. The present invention is a copper-nickel alloy electroplating device (1), which is characterized in that it has: a cathode chamber (4), in which an object to be plated (5) is arranged; an anode chamber (6); an anode (7), which is Disposed inside the anode chamber; an energized diaphragm (14), which is configured to separate the cathode chamber and the anode chamber; a cathode chamber redox potential adjustment tank (8), which is used to adjust the oxidation of the electroplating solution in the cathode chamber reduction potential; an anode chamber redox potential adjustment tank (10) for adjusting the redox potential of the electroplating solution in the anode chamber; and a power supply part (36) for allowing current to flow between the object to be plated and the anode. |
| priorityDate | 2014-10-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 132.