http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107059008-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F1-44 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23F1-44 |
| filingDate | 2017-01-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2020-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2020-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-107059008-B |
| titleOfInvention | Tin stripping liquid for removing soldering tin material on waste PCB and preparation method thereof |
| abstract | The invention discloses a solder stripping liquid for removing soldering tin on a waste PCB and a preparation method thereof, wherein the solder stripping liquid comprises the following components in percentage by weight: 25-50% of mixed acid, 1.0-40.0% of accelerator, 0.1-4.0% of tin dissolving agent, 0.1-3.0% of corrosion inhibitor, 0.1-3.5% of brightener, 0.1-3.0% of surfactant and the balance of water; wherein the mixed acid is a mixture of two or more of p-toluenesulfonic acid, trifluoromethanesulfonic acid, oxalic acid, sulfosalicylic acid, phosphoric acid, hydrochloric acid, sulfuric acid, polyphosphoric acid, hydrofluoric acid and nitric acid. The invention can solve the problem that the existing tin stripping solution has high nitric acid content to erode the base material and the copper surface, and has high tin stripping efficiency. |
| priorityDate | 2017-01-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 64.