| abstract |
Disclosed herein are compositions for removing silicone resin, methods of using the same to thin substrates and fabricate semiconductor packages, and systems using the same. More particularly, disclosed herein are compositions for removing silicone resins comprising a heterocyclic solvent and a fluorinated alkylammonium salt represented by the formula (R) 4 N + F ‑ , where R is C1‑C4 straight chain alkyl. The silicone resin can be effectively removed by using the composition because the composition exhibits an excellent decomposition rate for the silicone resin remaining on the semiconductor substrate during back grinding of the semiconductor substrate, back electrode formation, and the like. |