| abstract |
The present invention is a surface protection film, a manufacturing method, and a substrate processing laminate. The surface protection film including the base film and the resin film thereon can be bonded to the substrate having the circuit forming surface and separated therefrom after processing. The resin film is formed of a resin composition comprising (A) a resin containing a silylphenylene-siloxane skeleton, (B) a compound capable of reacting with epoxy groups in the resin to form a cross-linked structure , (C) a curing catalyst, and (D) a mold release agent. |