http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107026160-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-02 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-02 |
| filingDate | 2017-01-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2022-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2022-03-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-107026160-B |
| titleOfInvention | Integrated chip, semiconductor structure, method of forming integrated dielectric waveguide and method of forming semiconductor structure |
| abstract | The present disclosure relates to an integrated chip having a multi-band transmitting element and a receiving element coupled to an integrated dielectric waveguide. In some embodiments, an integrated chip has a dielectric waveguide disposed within an interlayer dielectric structure over a substrate. A multi-band transmission element having a plurality of phase modulation elements is configured to generate a plurality of modulated signals in different frequency bands. A plurality of transmission electrodes are positioned along the first side of the dielectric waveguide and are each configured to couple one of the plurality of modulated signals into the dielectric waveguide. In addition, a method of forming an integrated dielectric waveguide is also disclosed. |
| priorityDate | 2016-01-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 41.