http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-107022755-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-422 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-2086 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C18-30 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-30 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C18-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42 |
| filingDate | 2017-01-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2018-06-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2018-06-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-107022755-B |
| titleOfInvention | For by the method for the through-hole electroless copper of printed circuit board, the catalytic solution for it and the method that is used to prepare catalytic solution |
| abstract | The present invention is provided to by the method for the through-hole electroless copper of printed circuit board, the catalytic solution for it and the method that is used to prepare catalytic solution.Specifically, a kind of be used for the method for the through-hole electroless copper of the wherein printed circuit board of laminated conductive layer and non-conductive layer is provided.The method includes：Anionic is carried out to through-hole using alkaline predip solution；Catalyst treatment is carried out to through-hole using the catalytic solution containing complex, palladium ion ligand of the complex by palladium ion and selected from pyridine and 3 pyridinemethanols forms；With electroless copper is carried out on the surface of through-hole. |
| priorityDate | 2016-05-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 74.