| abstract |
A kind of method includes implementing first shock technique so that the metal coupling of the first package assembling hits the metal pad of the second package assembling.First of metal coupling and metal pad includes copper.Second of metal coupling and metal pad includes aluminium.This method further includes implementing second shock technique so that metal coupling hits metal pad.Implement annealing so that metal coupling is bonded on metal pad.The present embodiments relate to encapsulation and forming method thereof and for more shock techniques of engagement. |