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filingDate 2015-11-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2020-08-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2020-08-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-107004560-B
titleOfInvention Method and system for improving process uniformity
abstract A semiconductor processing chamber may include a remote plasma region, and a processing region fluidly coupled to the remote plasma region. The processing area may be configured to receive the substrate on the support base. The support base may comprise a first material at an inner region of the base. The support base may also include an annular member coupled to a remote portion of the base or at an outer region of the base. The annular member may comprise a second material different from the first material.
priorityDate 2014-11-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 26.