| abstract |
The invention provides a conductive paste which is particularly suitable for use as a conductive paste for via hole conduction, has a good shape while maintaining a low resistance of a cured coating film layer, and easily provides a cured coating film layer having resistance to temperature change. The conductive paste of the present invention comprises: conductive fillers, chelating agent-forming substances, phenolic resins, modified epoxy resins, and printability improving agents. The printed circuit board of the present invention conducts the through-hole by using the cured product of the conductive paste. |