| abstract |
The embodiment provides a kind of ic package with and forming method thereof.A kind of method includes first die and the second tube core being attached to carrier, and first die has the first contact pad, and the second tube core has the second contact pad, and the first contact pad and the second contact pad have different structures.Releasing layer formation is above first die and the second tube core.Encapsulation agent is injected between carrier and releasing layer.One or more redistributing layers (RDL) are formed above first die, the second tube core and encapsulation agent, the first contact pad and the second contact pad make electrical contact with one or more RDL. |