| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-035
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2203-20 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F240-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1007
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F8-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J179-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L57-02 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J157-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J179-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06 |
| filingDate |
2016-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2021-01-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2021-01-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-106995678-B |
| titleOfInvention |
Polyimide adhesive |
| abstract |
The present invention relates to a polyimide-based adhesive. The present invention provides a polyimide-based adhesive having good low dielectric properties and excellent adhesion to copper. A polyimide-based adhesive comprising a polyimide (a A), hydrogenated petroleum resin (B), crosslinking agent (C) and organic solvent (D). This adhesive can be used for the manufacture of flexible printed wiring boards, printed wiring boards, and multilayer wiring boards using them. |
| priorityDate |
2015-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |