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filingDate 2017-03-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c26379cc9d0bda542e0299c7673e3f78
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publicationDate 2017-07-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-106946221-A
titleOfInvention Pliable pressure sensor production method based on " V " type groove array electrode
abstract The invention belongs to flexible sensing field and micro-nano system regions, specially the pliable pressure sensor production method based on " V " type groove array electrode.Pliable pressure sensor production method based on " V " type array electrode, the preparation of preparation and CNT/PDMS polymer including pliable pressure sensor " V " type groove array electrode, obtained two pliable pressure sensors " V " type groove array electrode is taken respectively as Top electrode and bottom electrode, CNT/PDMS laminated films form pliable pressure sensor as intermediate dielectric layer, encapsulation.The problem of for metal material and flexible substrate poor adhesion, the present invention selects dimethyl silicone polymer(PDMS)It is used as flexible substrate material, metal Ag is used as electrode material, and PDMS flexible substrates surface progress moditied processing is used to using plasma techniques to strengthen metal Ag and PDMS adhesiveness, " V " type groove Array microelectrode structure of design efficiently solves pliable pressure sensor metal electrode when occurring compared with large deformation and produces the problem of being broken.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109437094-A
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