http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106939432-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D1-04 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D1-04 |
| filingDate | 2017-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2018-05-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2018-05-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-106939432-B |
| titleOfInvention | A kind of compound additive and its process for producing of think gauge copper foil |
| abstract | The present invention discloses the compound additive and its process for producing of think gauge copper foil, and the composition of compound additive includes：DPS dimethyl disulfide formamides sodium sulfonate, MBT Suan Tongzhongdi areas leveling agent, M2 mercaptobenzoimidazoles, AEO aliphatic amine polyoxyethylenes, PPNI hexyl benzylamine salts, at least five kinds of compounds in C8H17SO3K perfluoro octyl sulfonic acids sodium, macromolecular quality gelatin, hydrochloric acid.The think gauge copper foil electrocrystallization particle that additive of the present invention manufactures is more uniform, refinement, copper foil has higher tension and elongation percentage performance, peel strength is high, etch resistant, thermal conductivity is good after pressing plate, using process above, reduce copper foil aftertreatment technology, production cost has been saved, and has improved production efficiency, there is great market prospects and economic value. |
| priorityDate | 2017-04-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 35.