| abstract |
The present invention relates to a kind of acidic chemical machine polishing liquor, it contains：Silicon-containing compound, abrasive grains, azole compounds, acid, amphoteric surfactant, oxidant and water.The pH value of the acid CMP planarization liquid is 36.The polishing fluid can be under acidity polishing environment, meet polishing speed and selection ratio during barrier polishing to various materials to require, while having very strong correction ability to the defect of semiconductor device surface, fast planarization can be realized, operating efficiency is improved, production cost is reduced. |