http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106912163-A

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filingDate 2017-04-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4cb91019fd538cbcd49cf9e583816d90
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_91387c8c58effbf84cee5cd22504575d
publicationDate 2017-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-106912163-A
titleOfInvention Small-pitch P2.5 double-layer circuit board manufacturing process
abstract The invention relates to a small-pitch P2.5 double-layer circuit board manufacturing process. The method: S1: Print the PCB diagram of the lamp surface and the driving surface of the small-pitch P2.5 double-layer circuit board to be produced on the thermal transfer paper by a laser printer or an inkjet printer; The drawing is pasted on the copper clad board with paper tape, the lamp surface is glued to the bottom layer, the driving surface is glued to the top layer, and positioning holes are drilled on the copper clad board; S3: Adsorb the toner on the heat transfer paper by the heat transfer machine To the copper clad board; S4: Wash away the excess copper clad, and complete the production of the small-pitch P2.5 double-layer circuit board. The process of the present invention changes the existing 4-layer board of the existing small-pitch P2.5 double-layer circuit board into a 2-layer board, and improves the problems of cumbersome process, high-frequency signal attenuation, and high production cost existing in the existing P2.5 small-pitch circuit board technology.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-111315141-A
priorityDate 2017-04-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 22.