| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-5073
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2363-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2203-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0047
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0207
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0959 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0094
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0097
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0047
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-245
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0306
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-24 |
| filingDate |
2016-09-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2019-06-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2019-06-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
CN-106912161-B |
| titleOfInvention |
The manufacturing method of hole-filling for printed wiring board |
| abstract |
According to the present invention, in the case where enabling it to be fully cured to the digging space potting resin for implementing the generation of back drill processing method prevent gap from generating.Utilize the redundance of the electroplating ventilating hole (1) of back drill processing method removal setting on a printed-wiring board, through-hole entirety is filled with hardening resin composition (6) using following filling perforations, make the curing degree 60~85% of potting resin by the heating less than 100 DEG C first, followed by 130~200 DEG C of heating, it is fully cured, the filling perforation hardening resin composition (6) is the curing agent that the liquid epoxy resin of every 100 parts by weight contains 1~200 parts by weight and does not contain solvent. |
| priorityDate |
2015-09-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |