| abstract |
The present invention provides a kind of composition epoxy resin and contain its prepreg, laminate and printed circuit board.The composition epoxy resin comprising following component: the epoxy resin of (A) containing DCPD structure: 38~54 parts by weight；(B) active ester curing agent: 30~36 parts by weight；(C) cyanate ester resin: 16~32 parts by weight.The present invention cooperates with facilitation using the mutual cooperation between three kinds of necessary components of above-mentioned certain content and mutually, has obtained composition epoxy resin as above.Using prepreg made of the composition epoxy resin, laminate and printed circuit board, under the premise of there is high humidity resistance and high heat resistance at the same time, also there are low thermal coefficient of expansion, low water absorption and excellent dielectric properties. |