http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106867411-B
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-044 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-00 |
| filingDate | 2016-10-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2021-04-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2021-04-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | CN-106867411-B |
| titleOfInvention | Slurry composition for chemical mechanical polishing, method for producing the same, polishing method, method for manufacturing semiconductor device, and polishing apparatus |
| abstract | The present invention relates to a slurry composition for chemical mechanical polishing, a method for producing the same, a polishing method, a method for manufacturing a semiconductor device, and a polishing apparatus. A slurry composition for a chemical mechanical polishing process includes a dispersion medium, and a polishing slurry having NO bonded to a surface thereof 3 ‑ Functional group cerium oxide particles. The cerium oxide particles are included in an amount of about 0.1 parts by weight to about 15 parts by weight, based on 100 parts by weight of the dispersion medium. |
| priorityDate | 2015-10-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 177.