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filingDate 2015-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_89fa436265b41007cd7d08f1243fa1a3
publicationDate 2017-06-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-106808108-A
titleOfInvention A kind of lead-free aluminum solder wire and preparation method thereof
abstract The present invention relates to a kind of lead-free aluminum solder wire and preparation method thereof, in percentage by weight, including metal part 1.2-3.0%, scaling powder 97-98.8%;Wherein described metal part, according to weight percentage, including tin 98-99.7% copper 0.3-2%;Described scaling powder, according to weight percentage, including fluorination azanol 60-85%, metal active salt 5-30%, activating agent 1-5%, corrosion inhibiter 0.1-5%, the solderability of lead-free aluminum solder wire of the invention is good, welding efficiency is higher, welding efficiency can improve more than 10%, splashed during welding small, be conducive to mitigating subsequent corrosion, reduce cleaning difficulty, save valuable tin solder, storage is difficult to reveal seepage scaling powder, splash larger when solving welding in the prior art, the solderability scaling powder with folder in solder stick not high can be leaked out, pollute the product of entire volume, the problems such as causing product rejection under serious conditions.
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priorityDate 2015-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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